WAKEFIELD 286-AB overview
Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board:1.19 inches; Maximum Footprint:1.000 x 0.500 inches; Natural Con...
Product details
Manufactured byWAKEFIELD
Product groupSemiconductor
DescriptionAluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board:1.19 inches; Maximum Footprint:1.000 x 0.500 inches; Natural Convection:58 degrees C at 4W; Forced Convection:7.4 degrees C/W at 200 LFM.
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WAKEFIELD
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Semiconductor
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