SEP8253

Trenton Systems SEP8253 Series Rugged Computer CPU Boards

Xeon® Scalable Performance Silver And Gold

HDEC Series Architecture delivers 88 lanes of PCIe to a compatible Backplane

Ruggedized, designed and made in USA x86 single board computer for demanding applications Up to 44 cores/88 threads and 8 ECC RDIMMs with up to 3TB of DDR4-2933 standard memory with Optane™ DC Persistent Memory support! The SEP8253 is designed to tackle the toughest industrial and embedded computing challenges.

The SHB’s overall dimensions are 13.345” (33.858cm) L x 5.750” (14.605cm) H. The standard cooling solution used on the SEP8253 SHBs enables placement of option cards approximately 2.975” (75.57mm) away from the top component side of the SHB. Some system integration applications using chassis such as 2U rackmount computers require lower profile cooling solutions. A low profile heat sink option is available for the HEP8225 board that allows option card placements of 1.550” (39.37mm) from the topside of the board. A low profile cooling solution usually results in a 25-30% reduction in a system’s maximum operating temperature rating. Contact Trenton Systems for more information on cooling solution options for the SEP8253 system host board.