Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K7P803611B-HC30 Specialized Hot IC, K7P803611B-HC30 SAMSUNG
DescriptionSamsung Semiconductor K7P803611B-HC30 Sram, Memory Density:9.4372 Mbit, Memory Width:36, Organization:256KX36, Supply Voltage-Nom (Vsup):3.3 V, Power Supplies:1.5, 3.3 V, Access Time-Max:1.6 ns
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