Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K7D321874C-HC33 Specialized Hot IC, SAMSUNG BGA
DescriptionSamsung Semiconductor K7D321874C-HC33 Sram, Memory Density:37.7487 Mbit, Memory Width:18, Organization:2MX18, Power Supplies:1.8/2.5 V, Clock Frequency-Max (fCLK):333 MHz
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