Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K6X8008T2B-TF70 Specialized Hot IC, SAMSUNG TSOP44
DescriptionSamsung Semiconductor K6X8008T2B-TF70 Sram, Memory Density:8.3886 Mbit, Memory Width:8, Organization:1MX8, Power Supplies:3/3.3 V, Access Time-Max:70 ns
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