Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K6F8016R6B-EF70 Specialized Hot IC, SAMSUNG BGA
DescriptionSamsung Semiconductor K6F8016R6B-EF70 Sram, Memory Density:8.3886 Mbit, Memory Width:16, Organization:512KX16, Supply Voltage-Nom (Vsup):1.8 V, Power Supplies:1.8 V, Access Time-Max:70 ns
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