Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K4S64323LH-HN75 Integrated Circuit, SAMSUNG BGA
DescriptionSamsung Semiconductor K4S64323LH-HN75 Dram, Memory Density:67.1089 Mbit, Memory Width:32, Organization:2MX32, Power Supplies:1.8/2.5, 2.5 V, Access Time-Max:6 ns, Clock Frequency-Max (fCLK):133 MHz, Refresh Cycles:4096
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