Product details
Manufactured bySamsung
Product groupModules
DescriptionSAMSUNG K4H1G0838M-TCB3 Specialized Hot IC, SAMSUNG TSOP66
DescriptionSamsung Semiconductor K4H1G0838M-TCB3 Dram, Memory Density:1.0737 Gbit, Memory Width:8, Organization:128MX8, Supply Voltage-Nom (Vsup):2.5 V, Power Supplies:2.5 V, Access Time-Max:700 ps, Clock Frequency-Max (fCLK):133 MHz, Refresh Cycles:8192
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