Multicomp Pro 507-1422 overview
MULTICOMP 507-1422 SOLDER, NO-CLEAN 0.7MM 500GSOLDER, NO-CLEAN 0.7MM 500G Material composition:99.3% Tin (Sn), 0.7% Copper (Cu) Alloy Flux type:400, Rosin based...
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Manufactured byMulticomp Pro
Product groupModules
DescriptionMULTICOMP 507-1422 SOLDER, NO-CLEAN 0.7MM 500GSOLDER, NO-CLEAN 0.7MM 500G Material composition:99.3% Tin (Sn), 0.7% Copper (Cu) Alloy Flux type:400, Rosin based, Halide free Temperature, melting:227(degree C) Diameter, wire:0.7mm Temperature, RoHS Compliant: Yes
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