Multicomp Pro 507-1409 overview
MULTICOMP 507-1409 SOLDER, NO-CLEAN 1.2MM 250GSOLDER, NO-CLEAN 1.2MM 250G Material composition:99.3% Tin (Sn), 0.7% Copper (Cu) Alloy Flux type:400, Rosin based, Halide free Temperature, melting:227(degree C) Diameter, wire:1.2mm Temperature, RoHS Compliant: Yes
What is Multicomp Pro 507-1409?
MULTICOMP 507-1409 SOLDER, NO-CLEAN 1.2MM 250GSOLDE.... MULTICOMP 507-1409 SOLDER, NO-CLEAN 1.2MM 250GSOLDER, NO-CLEAN 1.2MM 250G Material composition:99.3% Tin (Sn), 0.7% Copper (Cu) Alloy Flux type:400, Rosin based, Halide free Temperature, melting:227(degree C) Diameter, wire:1.2mm Temperature, RoHS Compliant: Yes
Product details
Manufactured byMulticomp Pro
Product groupModules
DescriptionMULTICOMP 507-1409 SOLDER, NO-CLEAN 1.2MM 250GSOLDER, NO-CLEAN 1.2MM 250G Material composition:99.3% Tin (Sn), 0.7% Copper (Cu) Alloy Flux type:400, Rosin based, Halide free Temperature, melting:227(degree C) Diameter, wire:1.2mm Temperature, RoHS Compliant: Yes
Manufacturer, product group, and supply
See who makes this product, where it belongs, and where available inventory may be listed.
Manufactured by
Multicomp Pro
View Multicomp Pro profile
Product group
Modules
Explore Modules
Available from
Sourcing support available
Start a sourcing request