Product details
Manufactured byIntel
Product groupTelephony
DescriptionIntel Dialogic SS7HDC High Density Signaling Board- 16 T1/E1 interface,4 high-speed SS7 signaling link,Conforms with DSI, enables MTP3, ISUP, TUP, SCCP, TCAP, MAP, IS41,INAP protocol
OverviewToday’s Signaling System 7 (SS7) networks require high-performance and high-density solutions to meet the growing demands of telecommunication networks throughout the world. Enhanced services and features such as short message service (SMS), televoting, local number portability, location-based services, and mobile communications are driving an ever-increasing need for performance and density. The Intel® NetStructure™ SS7HDC board is designed to meet the needs of telecommunication equipment manufacturers, systems integrators, and service providers deploying these services worldwide.The SS7HDC board offers SS7 performance and density for signaling, call control, wireless messaging, and intelligent network applications. With support for up to 128 SS7 links on a single board, high-density systems can be designed with these boards, and message signaling unit (MSU) throughput ensures high performance for the most demanding non-circuit related
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