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Manufactured byFEI
Product groupModules
DescriptionFEI V600CE Focused Ion Beam | High-Performance Circuit Edit and Design Debug Solution
OverviewThe V600CE™ focused ion beam (FIB) system incorporates the latest developments in ion column design, gas delivery and end point detection to provide fast, efficient, cost-effective editing on advanced integrated circuits at the 65 nm technology node and beyond. Circuit editing allows product designers to reroute conductive pathways and test the modified circuits in hours, rather than the weeks or months that would be required to generate new masks and process new wafers. Fewer, shorter modification and test cycles allow manufacturers to ramp new processes to profitable high volume yields faster, and be first to market with premium priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes: smaller geometries, higher circuit densities, exotic materials and complex interconnect structures. The V600CE can be configured for backside editing with an optional IR microscope and bulk silicon trenching package.
NanoChemix Gas DeliveryFIB circuit editing tools use controlled amounts of specific gases, injected near the beam at the sample surface, to enhance the speed and selectivity of the milling process, and to deposit conductive and insulating materials in precisely controlled patterns. The V600CE's innovative NanoChemix™ gas delivery system increases editing flexibility with variable pressure control and a wide variety of solid, liquid or gas precursor materials. Its unique tri-nozzle design ensures a symmetric, high-flux flow of agents. A dedicated central nozzle delivers precursor for metal depositions. Dual opposing nozzles deliver etch gases and eliminate the shadowing that occurs in trenches milled using single-nozzle systems. Gas mixtures are used to improve electrical performance of insulator depositions. Automated purge routines and controlled gas volumes provide fast, easy switching between gases and shorten pump down times. Integrated toxic gas monitors and complete compliance with SEMI S2 standards ensure operator safety.
Key FeaturesFast, precise circuit modifications allow design changes in hours without processing new silicon NanoChemix gas delivery system provides improved speed, flexibility, uniformity, and quality in material removal and deposition Sidewinder ion column delivers more current to a smaller spot for faster, more precise milling Simultaneous plots of SE and specimen current improve endpoint detection Fast, accurate cross-sectioning reveals defects and subsurface features Automated TEM sample preparation with low voltage final polish Electrical feed-throughs for probing applications Optional backside editing capability with near-infrared microscope and Si trenching package
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