Disco DFD6450 overview
Disco DFD6450 Fully Automatic Dicing Saw | for 200mm Featuring parallel dual-spindles, DFD6450 combines the best aspects of its predecessor, the DFD651, with th...
Product details
Manufactured byDisco
Product groupDicing Saw
DescriptionDisco DFD6450 Fully Automatic Dicing Saw | for 200mm
Parallel dual dicing saw with 6000 Series featuresFeaturing parallel dual-spindles, DFD6450 combines the best aspects of its predecessor, the DFD651, with the superior usability and process quality of the DFD6000 Series Dicing Saws. Designed to handle a wide range of dicing and grooving applications, the DFD6450 processes silicon, compound semiconductor wafers, ceramics and other materials used for electronic component applications. In addition, the DFD6450 also processes glass and other materials used for optical component applications.
A parallel dual design unique to DISCOThe DFD6450's parallel dual spindle design is unique to DISCO and offers several benefits. As the spindles are supported from the rear of the machine, they are easily accessible from the front for blade changes and other maintenance work. The design also supports specialized applications such as mounting multiple blades on each spindle for package singulation.
Improved usabilityThe 15-inch LCD touch panel with GUI (Graphical User Interface) allows for easy and intuitive operation. In addition, a spindle shaft-lock feature that automatically secures the spindle axis has been installed to make blade replacement quick and easy. DFD6450 also has a cutting water flow rate control feature, making it possible to set the cutting water flow rate for each set of device data.
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Disco
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Dicing Saw
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