BCM Advanced Research ESM-HRPL overview
ESM-HRPL by BCM Advanced Research is listed under COM-HPC Module and Carrier Board. BCM Advanced Research ESM-HRPL COM-HPC Module and Carrier Board | COM-HPC® Client Size C Module. LGA1700 socket supports 12/13/14th Gen Intel® Core™ Processors LGA1700 socket supports 12/13/14th Gen Intel® Core™ i9/i7/i5/i3 Processor…
Manufactured byBCM Advanced Research
Part number or familyESM-HRPL
Product typeCOM-HPC Module and Carrier Board
Product details
Manufactured byBCM Advanced Research
Product typeCOM-HPC Module and Carrier Board
DescriptionBCM Advanced Research ESM-HRPL COM-HPC Module and Carrier Board | COM-HPC® Client Size C Module. LGA1700 socket supports 12/13/14th Gen Intel® Core™ Processors
Key FeaturesLGA1700 socket supports 12/13/14th Gen Intel® Core™ i9/i7/i5/i3 Processor, up to 65W TDPIntel® R680E Chipset4 x 262-Pin DDR5 SO-DIMM sockets support up to 128GB, 3600~4000MT/s, optional ECC support (CPU dependent)Supports 4 Independent DisplaySupports 1 x PCIe Gen5 x16 , 1 x PEG x4, 2 x PCIe x4, 9 x PCIe Gen3 x1, 1 x PCIe Gen3 x1 for BMC2 x Intel® Ethernet Controller I226-V (2.5GbE)Supports 3 x DDI, 1 x eDPSupports 4 x USB3.2 Gen2x2, 8 x USB2.0, 2x SATAIIISupports 1 x Audio, 1 x I2C, 1 x SMBus, 1 x GSPI, 1 x IPMB, 1 x SPISupports Standard Operating Temperature 0°C ~ 60°C (32°F ~ 140°F)
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BCM Advanced Research
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Product type
COM-HPC Module and Carrier Board
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